產品分類 : 積體電路(IC)無線和射頻積體電路RF 功率分配器/分離器
產品數量: 272
描述:IC RF SPLITTER 1:2 16-LFCSP
封裝/規格:16-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC RF SPLITTER ACTIVE 16LFCSP
封裝/規格:16-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:SPLITTER/COMBINER 2.1-2.3GHZ
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:SPLITTER/COMBINER 1.71-1.99GHZ
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:SPLITTER/COMBINER 0.81-0.96GHZ
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:RF SPLITTER/COMBINER 5-1000MHZ
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC RF SPLITTER 1:3 ACT 16LFCSP
封裝/規格:16-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC RF SPLITTER ACTIVE 16LFCSP
封裝/規格:16-VFQFN Exposed Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC BOOSTER/SPLITTER ANT 8-SOIC
封裝/規格:8-SOIC (0.154", 3.90mm Width)
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC BOOSTER/SPLITTER ANT 8-SOIC
封裝/規格:8-SOIC (0.154", 3.90mm Width)
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC RF SPLITTER ACTIVE 5V 20LFCSP
封裝/規格:20-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC RF SPLITTER ACTIVE 5V 20LFCSP
封裝/規格:20-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:POWER DIVIDER 945-979 MHZ
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:POWER DIVIDER 1607-1685 MHZ
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:POWER DIVIDER 2100-2200MHZ
庫存數量:1 +
10 +
100 +
500 +
>=1000