產品分類 : 積體電路(IC)無線和射頻積體電路RF 前端 (LNA + PA)
產品數量: 191
描述:WIRELESS LAN FRONT-END MODULE
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:WIRELESS LAN FRONT-END MODULE
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC FRONT END MOD 5GHZ WLAN 16QFN
封裝/規格:16-XFQFN Exposed Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:900 MHZ, RX FEM WITH DUAL ANTENN
封裝/規格:24-VFQFN Exposed Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC PROCESSOR FRONT END 64LFCSP
封裝/規格:64-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC PROCESSOR FRONT END 64LFCSP
封裝/規格:64-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC FRONT END MOD RF 2.4GHZ 20QFN
封裝/規格:20-UFQFN Exposed Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC DUAL IF RCVR 80HTQFP
封裝/規格:80-TQFP Exposed Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC FRONTEND MOD 802.11N DL 24QFN
封裝/規格:24-VFQFN Exposed Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC RF FRONT END 2.4GHZ 16QFN
封裝/規格:16-VFQFN Exposed Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC OPAMP GPS FE 1.5GHZ 10TDFN
封裝/規格:10-WFDFN Exposed Pad
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC FRONT-END MIXED-SGNL 128-LQFP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC FRONT-END MIXED-SGNL 64-LFCSP
封裝/規格:64-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC PROCESSOR FRONT END 64LFCSP
封裝/規格:64-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000
描述:IC IF SUBSYSTEM GEN-PURP 48LFCSP
封裝/規格:48-VFQFN Exposed Pad, CSP
庫存數量:1 +
10 +
100 +
500 +
>=1000